Chapter 17. Stress Analysis and Dynamic Simulation

This chapter will cover the tools of the Stress Analysis and Dynamic Simulation environments found in the Inventor Professional suite and the Inventor Simulation suite. The Stress Analysis environment allows you to perform static and modal analysis on parts and assemblies by defining component materials, loads, constraints, and contact conditions. The Dynamic Simulation environment allows you to analyze an assembly in motion by specifying loads, constraints, motion joints velocities, acceleration, and environmental factors such as gravity and friction. Both environments can be used together to determine motion loads enacted upon one component by another component at a given point in time.

In this ...

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