Chapter 12 Laser Beam Micro-Joining
Introduction
The joining processes in electronic device manufacturing are today still dominated by conventional joining techniques such as press fitting, crimping and resistance welding. Laser beam joining techniques have been under intensive investigation and subsequently new processes for mass manufacturing and high accuracy assembling have been established. With the newly developed SHADOW® welding technology, technical aspects such as tensile strength, geometry and precision of the weld can be improved. This technology provides the greatest flexibility in weld geometry with a minimum welding time as well as new possibilities in using application adapted materials. Different ...
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