Substituting (A2.6) into (A2.5) we obtain the result for minimum travel time (3.55):
s ¼
L
a
H
s
H
(A2.7)
LIST OF SYMBOLS
Symbol Meaning
a Energy barrier width, tile size
a
H
Heisenberg distinguishability length
a
HB
Boltzmann-Heisenberg length
BIT Maximum binary throughput
C Capacitance
d Distance
e Electron charge, e ¼ 1.6 10
–19
C
E Energy
E
b
Energy barrier height
E
sw
Switching energy
f Frequency
F Force
F Fan-out
G Conductance
G
0
Quantum conductance, G
0
¼ 7.75 10
–5
A/V
h Planck’s constant, h ¼ 6.63 10
–34
J$s
Z Reduced Planck’s constant - ¼ h/2p ¼ 1.055 10
–34
J$s
I Current
k Number of tiles
k
B
Boltzmann constant, k
B
¼ 1.38 10
–23
J/K
L, l Length
m Mass
m
e
Electron mass, m
e
¼ 9.31 10
–31
kg
n Device packing density
n
i
Intrinsic carrier concentration in an undoped semiconductor (for
Si, n
i
¼ 1.45 10
10
cm
–3
)
N Number of binary switches
N
a
Concentration of ionized acceptor impurities in semiconductor
N
þ
d
Concentration of ionized donor impurities in semiconductor
N
e
Number of electrons
p Momentum
P Power
R Resistance
R
0
Quantum resistance, R
0
¼ 12.9 k
U
88 CHAPTER 3 Nanomorphic electronics
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