Nanoelectronic Device Applications Handbook

33	Integrating Low-Temperature Carbon Nanotubes as Vertical Interconnects in Si Technology Sten Vollebregt, Ryoichi Ishihara, Jaber Derakhshandeh, Johan van der Cingel, Hugo Schellevis and C. I. M. Beenakker

CONTENTS

33.1  Introduction

33.2  Experimental

33.3  Results and Discussion

33.3.1  Surface Treatment of TiN

33.3.2  I–V Characterization of Top-Down Integrated CNT

33.3.3  Covering CNT for Bottom-Up

33.4  Conclusions

Acknowledgments

References

33.1  INTRODUCTION

Since their discovery, many applications have been proposed for vertically aligned carbon nanotubes (CNT). Some potential areas for the use of CNT are supercapacitors [1], microelectromechanical systems (MEMS) [2], and displays [3]. For these applications, the unique high-aspect-ratio ...