7.1 Introduction
In deep submicron (DSM) technology, the importance of on-chip wiring (interconnect) becomes significant as it impacts the system performance and cost to a big extent. With the technology shrinking, on-chip interconnect suffers from increased resistance due to decrease in metal cross-sectional area and also suffers from increased capacitance if the metal height is not reduced proportionally with metal spacing. Therefore, resistance-capacitance (RC) parameter in interconnects plays an increasing role in system-on-chip (SoC) performance as feature size scales. In integrated circuit (IC) packaging, usage of multiple interconnection layers is a common trend in order to ...
