Physical Design for 3D Integrated Circuits

2	Overview of Physical Design Issues for 3D-Integrated Circuits Drivers, Technology, Applications, and Outlook Aida Todri-Sanial

CONTENTS

Abstract

2.1    Introduction

2.2    Overview of 3D Physical Design Challenges

2.3    Challenges and Solutions for 3D Power Delivery Networks

2.4    Challenges and Solutions for 3D Clock Delivery Networks

2.5    Challenges and Solutions for 3D Placement and Routing

2.6    Challenges and Solutions for 3D Floorplanning

2.7    Challenges and Solutions on TSV Sizing and Placement

2.8    Summary and Conclusions

References

ABSTRACT

Three-dimensional integration presents a broad spectrum of challenges to designers of high-performance and energy-efficient circuits. Seeking to improve both the energy efficiency ...