Physical Design for 3D Integrated Circuits

10	Thermal Modeling and Management for 3D Stacked Systems Tiansheng Zhang, Fulya Kaplan, and Ayse K. Coskun

CONTETS

Abstract

10.1  Introduction

10.2  Thermal Modeling

10.2.1  Thermal Modeling of 3D-Stacked Systems

10.2.2  Integration of Full-System Simulation and Thermal Modeling

10.2.3  Thermal Modeling with Active Cooling

10.3  Thermal Management

10.3.1  Job Allocation and Migration

10.3.2  Thermal Management through Hardware Control Knobs

10.3.3  Management of 3D-Stacked Systems with Active Cooling

10.4  Summary and Conclusions

References

ABSTRACT

3D stacking technology allows integration of different technologies onto a single chip and provides performance benefits by decreasing communication latency. However, stacking resources vertically ...