Physical Design for 3D Integrated Circuits

15	Design Challenges and Solutions for Monolithic 3D ICs Sung Kyu Lim and Yiyu Shi

CONTENTS

Abstract

15.1  Introduction

15.2  Monolithic 3D-IC Fabrication

15.3  Monolithic 3D Design Challenges and Opportunities

15.4  Monolithic 3D SRAM Design

15.5  Transistor-Level Monolithic 3D-IC Design

15.6  Gate-Level Monolithic 3D-IC Design

15.7  Block-Level Monolithic 3D-IC Design

15.8  Conclusion

References

ABSTRACT

Monolithic three-dimensional integrated circuit (3D-IC) is a vertical integration technology that builds and stacks two or more tiers of devices sequentially, rather than bonding two independently fabricated dies together using bumps and/or through-silicon vias (TSVs). Compared to other existing 3D integration technologies (wire-bonding, ...