Contributors
Mario A. Bolaños: Mario Bolaños has more than thirty years’ experience in semiconductor packaging and is the strategic packaging research and university collaborations manager at Texas Instruments’ packaging organization. This organization is responsible for researching new, pathfinding packaging technology for TI. Mario is the author of ten patents, numerous technical papers, and keynote speeches around the world. He received his B.S. in electrical engineering at Jesuit University (UCA) in El Salvador in 1976, and a Master’s degree from the University of Texas at Dallas in 1995.
Swagato Chakraborty: Dr. Swagato Chakraborty is the vice president of products at Physware, Inc. Dr. Chakraborty received his Ph.D. from the department ...
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