October 2010
Intermediate to advanced
416 pages
10h 31m
English
As the Printed Circuit Board (PCB) interconnection density and channel data rate increasingly intensify, various 3D electromagnetic effects, crosstalk, and discontinuity-induced ISI represent an even more significant role for both signal channels and power distribution networks. In particular, noise coupling between signal trace and power delivery network constitutes a key issue and performance limiter for the high-speed I/O interface, which must be addressed appropriately. Understanding these combined signal integrity and power integrity issues in the era of gigahertz data rate requires advanced co-design methodology for signal integrity and power integrity analysis. In this chapter, we describe ...
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