Chapter 7. Signal/Power Integrity Interactions

As the Printed Circuit Board (PCB) interconnection density and channel data rate increasingly intensify, various 3D electromagnetic effects, crosstalk, and discontinuity-induced ISI represent an even more significant role for both signal channels and power distribution networks. In particular, noise coupling between signal trace and power delivery network constitutes a key issue and performance limiter for the high-speed I/O interface, which must be addressed appropriately. Understanding these combined signal integrity and power integrity issues in the era of gigahertz data rate requires advanced co-design methodology for signal integrity and power integrity analysis. In this chapter, we describe ...

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