The JEDEC Standards (JESD)
When trying to estimate temperature from published thermal resistance values in a chip datasheet, or when comparing vendors, it is important to know the following.
Historically, the SEMI organization drafted the initial standards for ceramic packages, integrated circuit packages and semiconductor packages.
Some key SEMI standards to note are
1. SEMI G30-88 “Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages.”
2. SEMI G38-87 “Test Method for Still- and Forced-Air Junctionto-Ambient Thermal Resistance Measurements of Integrated Circuit Packages.”
3. SEMI G68-0996 “Test Method for Junction-to-Case Thermal Resistance Measurements in an Air Environment for Semiconductor Packages.” ...