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Materials for printed films

J. Hormadaly, Ben-Gurion University, Israel

M. Prudenziati, University of Modena and Reggio Emilia, Italy

Abstract:

The chapter provides a critical survey of the compositions of materials (pastes and substrates) for applications in thick-film microelectronics and sensors. The evolution of the technology is illustrated with wide references to publications and patents.

Key words

thick-film compositions

air- and nitrogen-fired resistors

conductors

dielectrics

deposition medium

glass and glass ceramics

substrates

2.1 Introduction

Thick-film (TF) materials or TF compositions and the general term ‘thick-film technology’ have been the subject of reviews (Bouchard, 1999; Hoffman, 1984; Larry et al., 1980 ...

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