Materials for printed films
J. Hormadaly, Ben-Gurion University, Israel
M. Prudenziati, University of Modena and Reggio Emilia, Italy
Abstract:
The chapter provides a critical survey of the compositions of materials (pastes and substrates) for applications in thick-film microelectronics and sensors. The evolution of the technology is illustrated with wide references to publications and patents.
Key words
thick-film compositions
air- and nitrogen-fired resistors
conductors
dielectrics
deposition medium
glass and glass ceramics
substrates
2.1 Introduction
Thick-film (TF) materials or TF compositions and the general term ‘thick-film technology’ have been the subject of reviews (Bouchard, 1999; Hoffman, 1984; Larry et al., 1980 ...
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