Multilayer low-temperature co-fired ceramic systems incorporating a thick-film printing process
M. Sobocinski, J. Putaala and H. Jantunen, University of Oulu, Finland
Abstract:
Since the first application of low-temperature co-fired ceramics (LTCC) – a radar chip manufactured by DuPont and Hughes – in the 1980s, LTCC has gone through many changes, evolving from a simple multilayer substrate technology to a complex microelectronic system suitable for ‘intelligent’ packages with buried passive components, heat sinks, sensors, actuators, energy harvesters and even microsystems. Moreover, novel materials and enhanced processes have been introduced constantly. This chapter presents LTCC technology, starting from material development followed ...
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