Characterization and Failure Analysis of Materials and Devices
Abstract
When there are compelling reasons to find the physical causes for low yields, poor performance, degradation, or failure of components, devices, and systems, an experimental investigation of some sort is usually undertaken. Depending on the information sought and the complexity involved, the study may involve little more than a tedious testing routine, have all the earmarks of unraveling a detective mystery, or resemble a research project. In addressing the totality of issues raised in this book, the experimental studies conducted generally have one or more objectives discussed in this chapter.
Keywords
Charge carriers; Focused ion beams (FIB); p-n junction; Scanning ...Get Reliability and Failure of Electronic Materials and Devices, 2nd Edition now with the O’Reilly learning platform.
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