Resilience in next-generation embedded systems*
E. Cheng; S. Mitra Stanford University, Stanford, CA, United States
Abstract
This chapter presents a unique framework that overcomes a major challenge in the design of rugged embedded systems: achieve desired resilience targets at minimal costs (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, algorithm). This is also referred to as cross-layer resilience. This framework automatically and systematically explores the large space of comprehensive resilience techniques and their combinations across various layers of the system stack, derives cost-effective solutions that achieve ...
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