Authors
Andrea Chen received a B.S. in Materials Science and Engineering from University of California, Berkeley and a M.S. in Materials Engineering from Rensselaer Polytechnic Institute, New York. She started her career at National Semiconductor Corporation in the Package Technology group, working on various semiconductor packaging materials and reliability issues. Subsequently, she went to ChipPAC, Inc., with the Technology Development group, involved in low-cost flip-chip technology development. Currently, Chen works at Siliconware USA, Inc. (SPIL) as a technical marketing manager. To date, she has coauthored more than 30 papers and presentations.
Randy Hsiao-Yu Lo received his B.S. from National Taiwan University, Taiwan in 1979; M.S ...
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