2.1 Objectives
• List and categorize the different types of plastic semiconductor packages currently available on the market.
• Discuss the various failure modes plastic packages are subject to, and potential remedies.
2.2 Introduction
The variety of plastic semiconductor packages available in the industry only continues to proliferate over time. Even as new types and form factors come into being, the established players do not disappear entirely, given their long, reliable history and cost-competitiveness when price and not performance is the primary factor for package selection. Table 2.1 shows the mature package families of dual in-line, small outline, and thin small outline packages ...
