3.1 Objectives
• Provide a brief overview of semiconductor packages used in surface-mount technology of printed circuit boards.
• Discuss how issues particular to surface-mount technology affect semiconductor packages.
• Touch upon future developments in the area of surface-mount technology.
3.2 Introduction
Surface-mount technology (SMT) refers to how various semiconductors, passives, and other components are attached to a printed circuit board (PCB), to both the top and bottom surfaces. In the beginning of the electronics industry, both packages and PCBs were relatively large in scale. Through-hole packages prevalent in the early days were called that because their leads fit into the holes ...
