3.1 Objectives

Provide a brief overview of semiconductor packages used in surface-mount technology of printed circuit boards.

Discuss how issues particular to surface-mount technology affect semiconductor packages.

Touch upon future developments in the area of surface-mount technology.

3.2 Introduction

Surface-mount technology (SMT) refers to how various semiconductors, passives, and other components are attached to a printed circuit board (PCB), to both the top and bottom surfaces. In the beginning of the electronics industry, both packages and PCBs were relatively large in scale. Through-hole packages prevalent in the early days were called that because their leads fit into the holes ...

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