4.1 Objectives
• List and categorize other devices and technologies that require some form of electronic packaging.
• Discuss current status and future developments for these other devices and technologies.
4.2 Introduction
This chapter looks at electronic packaging needs for specialized functions and devices, as well as specialized semiconductor technologies.
4.3 Tape automated bonding
Tape automated bonding (TAB) is an alternate method to wire bonding for creating interconnections from chip to lead frame or substrate.
Introduced into production during the mid-1970s, TAB saw its peak usage in the 1980s to early 1990s, when the fine pitch capability in gold thermosonic wire bonding was still lacking, ...
