7.1 Lead frames, heat spreaders, and heat sinks

7.1.1 Objectives

Describe the purpose and usage of lead frames.

Explain the difference between heat spreaders and heat sinks.

Convey the purpose and importance of lead frames in semiconductor packaging.

Discuss the special role of heat spreaders and heat sinks.

7.1.2 Introduction

This section looks at the use of metallic lead frames as a carrier for semiconductor chips. Also presented is a brief discussion on the use of heat spreaders and heat sinks to increase a chip’s and package’s thermal dissipation when necessary for proper operation and long operating life.

7.1.3 Lead frames

Metal lead frame carriers have been used in semiconductor packaging almost ...

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