7.1 Lead frames, heat spreaders, and heat sinks
7.1.1 Objectives
● Describe the purpose and usage of lead frames.
● Explain the difference between heat spreaders and heat sinks.
● Convey the purpose and importance of lead frames in semiconductor packaging.
● Discuss the special role of heat spreaders and heat sinks.
7.1.2 Introduction
This section looks at the use of metallic lead frames as a carrier for semiconductor chips. Also presented is a brief discussion on the use of heat spreaders and heat sinks to increase a chip’s and package’s thermal dissipation when necessary for proper operation and long operating life.
7.1.3 Lead frames
Metal lead frame carriers have been used in semiconductor packaging almost ...
