8.1 Objectives
• Briefly discuss the uses of ceramic and glass materials in semiconductor packaging.
• Describe the types of ceramic and glass materials used in semiconductor packaging, along with their advantages and disadvantages.
• Describe and illustrate some commonly used hermetic semiconductor packages.
8.2 Introduction
Ceramics and glasses used in electronic packaging are typically electrical insulators. They are not generally used in plastic semiconductor packaging but are rather used in hermetic packaging given their physical properties.
As stated in Chapter 1, hermetic packages are needed for high-reliability, high-performance applications such as military and aerospace applications. By ...
