Book description
The #1 Practical Guide to Signal Integrity Design—with Revised Content and New Questions and Problems!
This book brings together uptotheminute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching several thousand engineers and graduate students, worldrenowned expert Eric Bogatin systematically presents the root causes of all six families of signal integrity, power integrity, and electromagnetic compatibility problems. Bogatin reviews essential principles needed to understand these problems, and shows how to use best design practices and techniques to prevent or address them early in the design cycle. To help test and reinforce your understanding, this new edition adds questions and problems throughout. Bogatin also presents more examples using free tools, plus new content on highspeed serial links, reflecting input from 130+ of his graduate students.
• A fully uptodate introduction to signal integrity and physical design
• New questions and problems designed for both students and professional engineers
• How design and technology selection can make or break power distribution network performance
• Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance
• Practical techniques for analyzing resistance, capacitance, inductance, and impedance
• Using QUCS to predict waveforms as voltage sources are affected by interconnect impedances
• Identifying reflections and crosstalk with free animation tools
• Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement
• Understanding how interconnect physical design impacts signal integrity
• Managing differential pairs and losses
• Harnessing the full power of Sparameters in highspeed serial link applications
• Designing highspeed serial links associated with differential pairs and lossy lines—including new coverage of eye diagrams
• Ensuring power integrity throughout the entire power distribution path
• Realistic design guidelines for improving signal integrity, and much more
For professionals and students at all levels of experience, this book emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor. It has earned a welldeserved reputation as the #1 resource for getting signal integrity designs right—first time, every time.
Table of contents
 Cover Page
 Title Page
 Copyright Page
 Dedication Page
 Contents at a Glance
 Contents
 Preface to the Third Edition
 Preface to the Second Edition
 Preface to the First Edition
 Acknowledgments
 About the Author

Chapter 1. Signal Integrity Is in Your Future
 1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?
 1.2 SignalIntegrity Effects on One Net
 1.3 Cross Talk
 1.4 RailCollapse Noise
 1.5 Electromagnetic Interference (EMI)
 1.6 Two Important SignalIntegrity Generalizations
 1.7 Trends in Electronic Products
 1.8 The Need for a New Design Methodology
 1.9 A New Product Design Methodology
 1.10 Simulations
 1.11 Modeling and Models
 1.12 Creating Circuit Models from Calculation
 1.13 Three Types of Measurements
 1.14 The Role of Measurements
 1.15 The Bottom Line
 EndofChapter Review Questions

Chapter 2. Time and Frequency Domains
 2.1 The Time Domain
 2.2 Sine Waves in the Frequency Domain
 2.3 Shorter Time to a Solution in the Frequency Domain
 2.4 SineWave Features
 2.5 The Fourier Transform
 2.6 The Spectrum of a Repetitive Signal
 2.7 The Spectrum of an Ideal Square Wave
 2.8 From the Frequency Domain to the Time Domain
 2.9 Effect of Bandwidth on Rise Time
 2.10 Bandwidth and Rise Time
 2.11 What Does Significant Mean?
 2.12 Bandwidth of Real Signals
 2.13 Bandwidth and Clock Frequency
 2.14 Bandwidth of a Measurement
 2.15 Bandwidth of a Model
 2.16 Bandwidth of an Interconnect
 2.17 The Bottom Line
 EndofChapter Review Questions

Chapter 3. Impedance and Electrical Models
 3.1 Describing SignalIntegrity Solutions in Terms of Impedance
 3.2 What Is Impedance?
 3.3 Real Versus Ideal Circuit Elements
 3.4 Impedance of an Ideal Resistor in the Time Domain
 3.5 Impedance of an Ideal Capacitor in the Time Domain
 3.6 Impedance of an Ideal Inductor in the Time Domain
 3.7 Impedance in the Frequency Domain
 3.8 Equivalent Electrical Circuit Models
 3.9 Circuit Theory and SPICE
 3.10 Introduction to MeasurementBased Modeling
 3.11 The Bottom Line
 EndofChapter Review Questions
 Chapter 4. The Physical Basis of Resistance

Chapter 5. The Physical Basis of Capacitance
 5.1 Current Flow in Capacitors
 5.2 The Capacitance of a Sphere
 5.3 Parallel Plate Approximation
 5.4 Dielectric Constant
 5.5 Power and Ground Planes and Decoupling Capacitance
 5.6 Capacitance per Length
 5.7 2D Field Solvers
 5.8 Effective Dielectric Constant
 5.9 The Bottom Line
 EndofChapter Review Questions

Chapter 6. The Physical Basis of Inductance
 6.1 What Is Inductance?
 6.2 Inductance Principle 1: There Are Circular Rings of MagneticField Lines Around All Currents
 6.3 Inductance Principle 2: Inductance Is the Number of Webers of Field Line Rings Around a Conductor per Amp of Current Through It
 6.4 SelfInductance and Mutual Inductance
 6.5 Inductance Principle 3: When the Number of Field Line Rings Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor
 6.6 Partial Inductance
 6.7 Effective, Total, or Net Inductance and Ground Bounce
 6.8 Loop Self and Mutual Inductance
 6.9 The Power Distribution Network (PDN) and Loop Inductance
 6.10 Loop Inductance per Square of Planes
 6.11 Loop Inductance of Planes and Via Contacts
 6.12 Loop Inductance of Planes with a Field of Clearance Holes
 6.13 Loop Mutual Inductance
 6.14 Equivalent Inductance of Multiple Inductors
 6.15 Summary of Inductance
 6.16 Current Distributions and Skin Depth
 6.17 HighPermeability Materials
 6.18 Eddy Currents
 6.19 The Bottom Line
 EndofChapter Review Questions

Chapter 7. The Physical Basis of Transmission Lines
 7.1 Forget the Word Ground
 7.2 The Signal
 7.3 Uniform Transmission Lines
 7.4 The Speed of Electrons in Copper
 7.5 The Speed of a Signal in a Transmission Line
 7.6 Spatial Extent of the Leading Edge
 7.7 “Be the Signal”
 7.8 The Instantaneous Impedance of a Transmission Line
 7.9 Characteristic Impedance and Controlled Impedance
 7.10 Famous Characteristic Impedances
 7.11 The Impedance of a Transmission Line
 7.12 Driving a Transmission Line
 7.13 Return Paths
 7.14 When Return Paths Switch Reference Planes
 7.15 A FirstOrder Model of a Transmission Line
 7.16 Calculating Characteristic Impedance with Approximations
 7.17 Calculating the Characteristic Impedance with a 2D Field Solver
 7.18 An nSection LumpedCircuit Model
 7.19 Frequency Variation of the Characteristic Impedance
 7.20 The Bottom Line
 EndofChapter Review Questions

Chapter 8. Transmission Lines and Reflections
 8.1 Reflections at Impedance Changes
 8.2 Why Are There Reflections?
 8.3 Reflections from Resistive Loads
 8.4 Source Impedance
 8.5 Bounce Diagrams
 8.6 Simulating Reflected Waveforms
 8.7 Measuring Reflections with a TDR
 8.8 Transmission Lines and Unintentional Discontinuities
 8.9 When to Terminate
 8.10 The Most Common Termination Strategy for PointtoPoint Topology
 8.11 Reflections from Short Series Transmission Lines
 8.12 Reflections from ShortStub Transmission Lines
 8.13 Reflections from Capacitive End Terminations
 8.14 Reflections from Capacitive Loads in the Middle of a Trace
 8.15 Capacitive Delay Adders
 8.16 Effects of Corners and Vias
 8.17 Loaded Lines
 8.18 Reflections from Inductive Discontinuities
 8.19 Compensation
 8.20 The Bottom Line
 EndofChapter Review Questions

Chapter 9. Lossy Lines, RiseTime Degradation, and Material Properties
 9.1 Why Worry About Lossy Lines?
 9.2 Losses in Transmission Lines
 9.3 Sources of Loss: Conductor Resistance and Skin Depth
 9.4 Sources of Loss: The Dielectric
 9.5 Dissipation Factor
 9.6 The Real Meaning of Dissipation Factor
 9.7 Modeling Lossy Transmission Lines
 9.8 Characteristic Impedance of a Lossy Transmission Line
 9.9 Signal Velocity in a Lossy Transmission Line
 9.10 Attenuation and dB
 9.11 Attenuation in Lossy Lines
 9.12 Measured Properties of a Lossy Line in the Frequency Domain
 9.13 The Bandwidth of an Interconnect
 9.14 TimeDomain Behavior of Lossy Lines
 9.15 Improving the Eye Diagram of a Transmission Line
 9.16 How Much Attenuation Is Too Much?
 9.17 The Bottom Line
 EndofChapter Review Questions

Chapter 10. Cross Talk in Transmission Lines
 10.1 Superposition
 10.2 Origin of Coupling: Capacitance and Inductance
 10.3 Cross Talk in Transmission Lines: NEXT and FEXT
 10.4 Describing Cross Talk
 10.5 The SPICE Capacitance Matrix
 10.6 The Maxwell Capacitance Matrix and 2D Field Solvers
 10.7 The Inductance Matrix
 10.8 Cross Talk in Uniform Transmission Lines and Saturation Length
 10.9 Capacitively Coupled Currents
 10.10 Inductively Coupled Currents
 10.11 NearEnd Cross Talk
 10.12 FarEnd Cross Talk
 10.13 Decreasing FarEnd Cross Talk
 10.14 Simulating Cross Talk
 10.15 Guard Traces
 10.16 Cross Talk and Dielectric Constant
 10.17 Cross Talk and Timing
 10.18 Switching Noise
 10.19 Summary of Reducing Cross Talk
 10.20 The Bottom Line
 EndofChapter Review Questions

Chapter 11. Differential Pairs and Differential Impedance
 11.1 Differential Signaling
 11.2 A Differential Pair
 11.3 Differential Impedance with No Coupling
 11.4 The Impact from Coupling
 11.5 Calculating Differential Impedance
 11.6 The ReturnCurrent Distribution in a Differential Pair
 11.7 Odd and Even Modes
 11.8 Differential Impedance and OddMode Impedance
 11.9 Common Impedance and EvenMode Impedance
 11.10 Differential and Common Signals and Odd and EvenMode Voltage Components
 11.11 Velocity of Each Mode and FarEnd Cross Talk
 11.12 Ideal Coupled TransmissionLine Model or an Ideal Differential Pair
 11.13 Measuring Even and OddMode Impedance
 11.14 Terminating Differential and Common Signals
 11.15 Conversion of Differential to Common Signals
 11.16 EMI and Common Signals
 11.17 Cross Talk in Differential Pairs
 11.18 Crossing a Gap in the Return Path
 11.19 To Tightly Couple or Not to Tightly Couple
 11.20 Calculating Odd and Even Modes from Capacitance and InductanceMatrix Elements
 11.21 The Characteristic Impedance Matrix
 11.22 The Bottom Line
 EndofChapter Review Questions

Chapter 12. SParameters for SignalIntegrity Applications
 12.1 SParameters, the New Universal Metric
 12.2 What Are SParameters?
 12.3 Basic SParameter Formalism
 12.4 SParameter Matrix Elements
 12.5 Introducing the Return and Insertion Loss
 12.6 A Transparent Interconnect
 12.7 Changing the Port Impedance
 12.8 The Phase of S21 for a Uniform 50Ohm Transmission Line
 12.9 The Magnitude of S21 for a Uniform Transmission Line
 12.10 Coupling to Other Transmission Lines
 12.11 Insertion Loss for Non50Ohm Transmission Lines
 12.12 DataMining SParameters
 12.13 SingleEnded and Differential SParameters
 12.14 Differential Insertion Loss
 12.15 The Mode Conversion Terms
 12.16 Converting to MixedMode SParameters
 12.17 Time and Frequency Domains
 12.18 The Bottom Line
 EndofChapter Review Questions

Chapter 13. The Power Distribution Network (PDN)
 13.1 The Problem
 13.2 The Root Cause
 13.3 The Most Important Design Guidelines for the PDN
 13.4 Establishing the Target Impedance Is Hard
 13.5 Every Product Has a Unique PDN Requirement
 13.6 Engineering the PDN
 13.7 The VRM
 13.8 Simulating Impedance with SPICE
 13.9 OnDie Capacitance
 13.10 The Package Barrier
 13.11 The PDN with No Decoupling Capacitors
 13.12 The MLCC Capacitor
 13.13 The Equivalent Series Inductance
 13.14 Approximating Loop Inductance
 13.15 Optimizing the Mounting of Capacitors
 13.16 Combining Capacitors in Parallel
 13.17 Engineering a Reduced Parallel Resonant Peak by Adding More Capacitors
 13.18 Selecting Capacitor Values
 13.19 Estimating the Number of Capacitors Needed
 13.20 How Much Does a nH Cost?
 13.21 Quantity or Specific Values?
 13.22 Sculpting the Impedance Profiles: The FrequencyDomain Target Impedance Method (FDTIM)
 13.23 When Every pH Counts
 13.24 Location, Location, Location
 13.25 When Spreading Inductance Is the Limitation
 13.26 The Chip View
 13.27 Bringing It All Together
 13.28 The Bottom Line
 EndofChapter Review Questions
 Appendix A. 100+ General Design Guidelines to Minimize SignalIntegrity Problems
 Appendix B. 100 Collected Rules of Thumb to Help Estimate SignalIntegrity Effects
 Appendix C. Selected References
 Appendix D. Review Questions and Answers
 Index
Product information
 Title: Signal and Power Integrity  Simplified, 3rd Edition
 Author(s):
 Release date: January 2018
 Publisher(s): Pearson
 ISBN: 9780134512228
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