Signal Integrity and Radiated Emission of High-Speed Digital Systems

Preface

Following the foreword by Prof. Canavero, we would like to give more details concerning the content of this book. The book is designed to meet the needs of high-speed digital designers and as support for electrical engineering and physics students who desire to gain knowledge of signal integrity (SI), electromagnetic interference (EMI) and radiated emission (RE) topics. One of the two authors has had industrial experience over a period of more than 30 years in designing telecommunication equipment, and the other author is a professor of the University of Rome, with research and academic educational experience. Therefore, the intention of the authors is to provide the reader with the fundamental principles of SI, EMI, and RE by using rigorous theory, appropriate models for prediction, and experimental results for investigation and validation of the models. The book's main objective is to study the electromagnetic (EM) phenomena concerning printed circuit boards (PCBs) and their attached cables, considering the interconnect driven and loaded by digital devices. This is a very important aspect to consider, as the non-linear behavior of digital devices greatly influences the performance of the interconnect in terms of reflection, crosstalk, and switching noise. Modeling of PCBs and cables is a basic topic of the book, as this helps significantly in reducing the cost of a product and in saving design time. This is a very important issue, bearing in mind the new European EMC ...