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Signal Integrity: From High Speed to Radiofrequency Applications by Fabien Ndagijimana

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Introduction

Electromagnetic compatibility considers the problems of equipment cohabitation and develops methods to control, predict and resolve the effects of various disturbances:

– emission of disruptions occurring on power and linking cables;
– radiated emissions near other equipment;
– immunity to disturbances propagating on power and linking cables;
– immunity to radiated disturbances;
– immunity to electrostatic discharges.

Signal integrity handles disturbances in the equipment itself: signal distortions during its propagation on networks, from cable to integrated circuit via connectors, printed circuits boards (PCBs) and electronic packages.

Figure I.1. Phenomena to account for in interconnects for signal integrity

images

Audio-video applications currently require higher and higher transmission speed and signal processing circuits, which leads to an ever-larger spectral occupation and thus to higher frequencies to be transmitted. At the same time, the presence of multiple parasite phenomena limits the bandwidth of the transmission channel:

– inductive or capacitive connectors and links;
– mismatch phenomena in transmission lines;
– cross-talk;
– noise related to the switching of power supplies and other circuits.

Thus, the transmission of the signal across a limited bandwidth transmission channel composed of packages, connectors and lines is manifested by distortions that can ...

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