Table of Contents
Woodhead Publishing Series in Electronic and Optical Materials
Part I: Silicon-on-insulator (SOI) materials and manufacture
1. Materials and manufacturing techniques for silicon-on-insulator (SOI) wafer technology
1.2 SOI wafer fabrication technologies: an overview
1.3 SOI volume-fabrication process
1.4 SOI wafer structures and characterization
1.5 Direct wafer bonding: wet surface cleaning techniques
1.6 Characterization of direct bonding mechanisms
1.7 Alternative surface preparation processes for Si and SiO2 direct bonding
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