Silicon Photonics: Fundamentals and Devices

1.6 Conclusions

From the discussions in the above sections, the following points emerge:

• The interconnect problem within a chip is taking an alarming shape. Optical interconnect based on silicon technology may offer a viable solution.
• The long-haul optical communication link employs at present a number of different devices (viz., lasers, modulators, power monitor and control, amplifiers, photodetectors, photoreceivers, multiplexers, demultiplexers, filters and other passive lightwave circuits, and active network components like wavelength converters, etc.). Apart from passive components, most of the active components are fabricated on the InP platform. A truly monolithic OEIC on silicon may offer all the advantages of integration including cost reduction.
• Si-based photonic devices may offer lower cost in the sector of data networks covering shorter distances.
• Si microphotonics seem to be an attractive solution for next-generation optical interconnects for chip-to-chip or board-to-board interconnects.
• Discrete silicon photonic devices like light-emitting diodes (LEDs) and lasers are in demand for consumer electronics, display, and mobile communication, and as mid-infrared or THz emitters.

Si-based passive lightwave circuits are well developed and find use in commercial optical communication and networking systems. Si-based photodetectors technology is also mature, and the devices are already in use. There are attempts to extend the operation to the important telecommunication ...