Soldering in Electronics Assembly, 2nd Edition

Soldering in Electronics Assembly, 2nd Edition

by MIKE JUDD, Keith Brindley
Released March 1999
Publisher(s): Newnes
ISBN: 9780080517346

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Book description

Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly.

Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.

  • A practical guide for the industry covering all the main soldering processes currently in use
  • Cleaning, faults, troubleshooting and standards are all major topics
  • Considers safety and solder process quality assessment

Table of contents

  1. Front Cover
  2. Soldering in Electronics Assembly
  3. Copyright Page
  4. Contents
  5. Foreword
  6. Preface
  7. Acknowledgements
  8. Chapter 1. Soldering process
    1. Time on its side
    2. Printed circuit board
    3. Soldering (1/2)
    4. Soldering (2/2)
    5. Soldering processes
    6. Component/solder (CS) processes
    7. Solder/component (SC) processes
    8. Cleaning
    9. Quality
    10. Safety
  9. Chapter 2. Electronics assemblies
    1. Joints
    2. Through-hole joints (1/2)
    3. Through-hole joints (2/2)
    4. Surface mounted components
    5. Surface mounted joints (1/2)
    6. Surface mounted joints (2/2)
    7. Assembly variations (1/2)
    8. Assembly variations (2/2)
    9. Assembly classification
  10. Chapter 3. Solder
    1. Metallurgical properties of tin/lead alloys
    2. The soldered joint (1/2)
    3. The soldered joint (2/2)
    4. Solderability (1/2)
    5. Solderability (2/2)
    6. Protective coatings (1/2)
    7. Protective coatings (2/2)
  11. Chapter 4. Lead-free solder
    1. What's needed in the future?
    2. Lead-free soldering — now a hot topic!
    3. The age of lead-free soldering is approaching fast
    4. ITRI
  12. Chapter 5. Flux
    1. Need for flux
    2. How fluxes work
    3. Categorization of fluxes (1/2)
    4. Categorization of fluxes (2/2)
    5. Choosing a flux
    6. Application of fluxes (1/2)
    7. Application of fluxes (2/2)
    8. SC soldering process flux
  13. Chapter 6. Solder paste
    1. Solder paste or adhesive application
    2. Dispensing
    3. Pin transfer
    4. Using solder paste
    5. Solder paste parameters
  14. Chapter 7. CS soldering processes
    1. Hand soldering
    2. Mass CS soldering processes
    3. Inert atmosphere soldering
    4. Handling assemblies
    5. Solder pots and pumps
    6. Solder pot heaters
    7. Soldering (1/3)
    8. Soldering (2/3)
    9. Soldering (3/3)
    10. Soldering process monitoring
  15. Chapter 8. SC soldering processes
    1. Heat application
    2. Infra-red soldering (1/2)
    3. Infra-red soldering (2/2)
    4. Hot air convection
    5. Hot vapour soldering
    6. Laser soldering
    7. Light beam soldering
    8. Heated collet or hot bar
    9. Miscellaneous SC soldering processes
    10. Comparison of soldering processes
  16. Chapter 9. Profiling soldering processes
    1. Profiles
    2. Infra-red soldering temperature profiles
    3. Hot vapour soldering temperature profiles
    4. Heated collet temperature profiles
    5. Optimizing temperature profiles
  17. Chapter 10. Cleaning soldered assemblies
    1. The Montreal Protocol
    2. Why clean at all?
    3. Contamination
    4. Classifications of cleaner
    5. Cleaning processes (1/2)
    6. Cleaning processes (2/2)
    7. Contamination testing
    8. Comparing the cleaning options
  18. Chapter 11. Avoiding problems — soldering quality
    1. Have problems occurred?
    2. Statistical process control
    3. Solutions to problems
    4. Criteria for the assessment of soldered joints
    5. Characteristics of soldered joints
    6. Classification of soldered joints
    7. Features of solder joints on surface mounted boards
    8. X-ray inspection
    9. Visual inspection standards
    10. Photographic guide to defects (1/8)
    11. Photographic guide to defects (2/8)
    12. Photographic guide to defects (3/8)
    13. Photographic guide to defects (4/8)
    14. Photographic guide to defects (5/8)
    15. Photographic guide to defects (6/8)
    16. Photographic guide to defects (7/8)
    17. Photographic guide to defects (8/8)
  19. Chapter 12. Standards & specifications
    1. Why comply with standards
    2. Reference to standards
    3. Levels of standards
    4. Standards organizations and bodies
    5. Standards for electronics assembly manufacture
    6. Guide to relevant worldwide standards (1/4)
    7. Guide to relevant worldwide standards (2/4)
    8. Guide to relevant worldwide standards (3/4)
    9. Guide to relevant worldwide standards (4/4)
    10. Glossary (1/3)
    11. Glossary (2/3)
    12. Glossary (3/3)
    13. References
  20. Further reading (1/2)
  21. Further reading (2/2)
  22. Worldwide addresses (1/2)
  23. Worldwide addresses (2/2)
  24. Appendix 1. Why not blame the machine? (1/2)
  25. Appendix 1. Why not blame the machine? (2/2)
  26. Appendix 2. Problems & solutions
  27. Appendix 3. Soldering safety (1/4)
  28. Appendix 3. Soldering safety (2/4)
  29. Appendix 3. Soldering safety (3/4)
  30. Appendix 3. Soldering safety (4/4)
  31. Appendix 4. Comparing soldering processes & machines
  32. Index

Product information

  • Title: Soldering in Electronics Assembly, 2nd Edition
  • Author(s): MIKE JUDD, Keith Brindley
  • Release date: March 1999
  • Publisher(s): Newnes
  • ISBN: 9780080517346