6

Technology Needs for Modular Pixel Detectors

Paul Seller

CONTENTS

6.1    Introduction

6.2    Hybrid Semiconductor X-Ray Imaging Detector Materials and Contacts

6.3    ASIC Technology for Hybrid Pixel Detector Readout

6.4    Area Interconnect

6.5    Noise

6.6    Cooling

6.7    Dead Areas in Modular Systems

6.8    Through-Silicon Via (TSV) for I/O Connection Needed for Low Dead Areas

6.9    3DIC Technology Advantages

6.10  Flatness and Stress

References

6.1    INTRODUCTION

Area-array imaging detectors are ubiquitous in our everyday lives and in science instrumentation. For imaging IR, visible, and UV photons, the usual approach taken is to use focusing optics to concentrate the light onto a small imaging area and to use the smallest pixels ...

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