P
P/I structure Packaging and interconnection structure. A generic term describing the substrate structure on which electronic components are mounted.
package The container for an electronic component with terminals to provide electrical access to the inside of the container. It usually provides hermetic and environmental protection for, and a particular form factor to, the assembly of electronic components.
packaging density The quantity of functions (components, interconnection devices, mechanical devices) per unit volume, usually expressed in qualitative terms, such as high, medium, or low.
pad (1) The portion of the conductive pattern on printed circuits designated for the mounting or attachment of components. (2) The area of a printed ...
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