The most important criterion in packaging consists of thermal management. It is not only the avoidance of the maximum temperature rating for device protection, but also the desire to operate at lower temperature. The power semiconductor devices operate better at lower temperature, with performance maintained within the specified data. Moreover, the lifetime of a power semiconductor device depends strongly on the temperature it operates at. A rule of thumb for silicon devices is that failure rates often double for every 10–15°C rise in operating temperature beyond 50°C [1].
After the power loss has been calculated at device level, the cooling system can be dimensioned. ...
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