Manufacturing of Three-Dimensional Packaged Systems
Abstract
Several approaches to reduce the form factor of packaged systems by using the third physical dimension are described in this chapter. Important commercial methods, such as system-in-package (SiP) and interposer-based (2.5-D) technologies are included. The most recent developments in the manufacturing of 2.5-D systems are reviewed. In addition to mainstream packaging techniques, such as SiP, other approaches that have been prototyped but have yet to reach high volume manufacturing are discussed, covering the entire spectrum of three-dimensional packaging. Particular attention is placed on the fabrication of interposers, as this integration technology has only recently appeared ...
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