Chapter 4

Electrical Properties of Through Silicon Vias

Abstract

The predominant type of vertical interconnection is the through silicon via (TSV). Due to the important role of this interconnect, this chapter is dedicated to models of the electrical behavior of this structure. Models of differing complexity are discussed and the appropriate model for the specific TSV processes and three-dimensional systems is described. The electrical characteristics of the TSVs and the RLC electrical models for these wires are described. Coupling between adjacent TSVs is discussed. The role of the return path in determining the electrical characteristics of the TSVs is also described. Comparisons between electromagnetic simulations and the compact models of TSVs ...

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