Three-Dimensional Integrated Circuit Design, 2nd Edition

Chapter 9

Physical Design Techniques for Three-Dimensional ICs

Abstract

The complexity of the three-dimensional (3-D) physical design process is discussed in this chapter. Several approaches for classic physical design issues, such as floorplanning, placement, and routing, from a 3-D perspective, are extensively reviewed. To enhance the understanding of these techniques targeted to 3-D systems, certain fundamental methods and algorithms used in the physical design of planar circuits are also discussed. Traditional issues such as partitioning, floorplanning, placement, and routing are reviewed. The task of through silicon via planning and the effect that this task has on the quality of 3-D floorplans are also described. Some layout tools developed ...