Thermal Management Strategies for Three-Dimensional ICs
Abstract
Thermal management methodologies for three-dimensional (3-D) systems are presented in this chapter. These techniques either lower the overall power of the 3-D stack or carefully distribute the power densities across the tiers of a 3-D system to satisfy local temperature limitations. Hybrid methodologies are also discussed. Both physical and architectural level methods are surveyed. Physical design techniques include thermal driven floorplanning and placement. Architectural level techniques are primarily based on dynamic thermal management for multi-core systems and systems comprised of several tiers of memory. Moreover, design techniques that utilize additional interconnect ...
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