Case Study
Thermal Coupling in 3-D Integrated Circuits
Abstract
A prototype circuit to enhance the understanding of thermal effects in 3-D structures is described in this chapter. The design of the prototype 3-D circuits based on the MIT Lincoln Laboratories process is described. The test circuits are used to evaluate thermal coupling among the tiers of a three tier stack and between blocks located within the same physical tier. Experimental results for different heating scenarios are presented. Based on these results, the effects of the TSVs on thermal coupling are discussed. The effect of TSV density on thermal coupling is also described.
Keywords
Thermal coupling; on-chip heating circuits; thermal hot spots
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