Wafer Manufacturing

5Modeling of the Wiresaw Manufacturing Process and Material Characteristics

This chapter continues the presentation from Chapter 4 to address the fundamentals of modern slurry wiresaw machining and engineering modeling. The topics include the following: an introduction of fundamentals of engineering modeling, the rolling‐indenting engineering model, analysis of vibration for the moving wire in the wiresaw manufacturing process, modeling of practical damping factors, elasto‐hydrodynamic interaction between the high‐speed elastic wire, slurry, and the ingot contact surface, thermal management, slurry and wire management, and material properties and their effects on wafering.

5.1 Introduction

Although the manufacturing process of a modern slurry wiresaw is subject to more stringent requirements to produce wafers with low total thickness variation (TTV), low warpage, and low residual stresses, the operation of industrial wiresaws today rely on ad hoc tuning of various process parameters to produce wafers in satisfactory conditions. Understanding the fundamental manufacturing process will enable and facilitate further development and advancement in wiresaw technology with more systematic results. This is the main motivation for the presentation of the recent research results in the “rolling‐indenting” engineering modeling of wiresaw manufacturing process, as well as other relevant analyses [Kao et al. (1998a, 1997a,b); Li et al. (1997, 1998); Sahoo et al. (1998); Zhu and Kao ( ...