Power Electronics and Motor Drive Systems

10.8. Mount Package Types of Semiconductor Devices and Types of Heat Sinks

Fig. 10.64 shows different types of mount packages of power semiconductor devices. As can be seen from Fig. 10.64(a), the mount packages TO-220, TO-268, and TO-264 are for low power semiconductor devices. The mount packages shown in Fig. 10.64(b) and (c) are for higher power applications.

The high power semiconductor switches analyzed in the previous sections, due to the high density of current that flows through their junctions, they exhibit power losses and, consequently, generate internally high temperature levels. Since the high temperature levels are affecting negatively the operation and the life time of the semiconductor devices, there is a need to design a proper ...