5 Circuits and Signals
In this chapter…
This chapter ties together, literally, all the components discussed up to this point. Three different circuit technologies used to manufacture RF components are introduced: discrete, hybrid, and MMIC. Their differences are noted, as well as the reasons why one is chosen over another in a particular situation. The three are also viewed from the standpoint of both performance and cost impact. Additionally, this chapter covers three different component interconnection schemes: cable, waveguide, and traces. Once again, the reasons why one is chosen over another are pointed out.
This chapter also introduces you to two different circuit philosophies: ...
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