June 2019
Intermediate to advanced
752 pages
22h 19m
English
The power analysis flow described in Chapter 13, “Power Analysis,” provides power dissipation data used for thermal modeling of the die/package combination and for confirmation of the overall SoC power specification. The power analysis flow also provides localized power dissipation data for hot spot identification. A related analysis flow utilizes switching activity and cell characterization power supply current waveforms to calculate the voltage drop on the VDD power and ground (P/G) distribution rails.
Power rail voltage drop analysis involves applying cell current data to an extracted model for the P/G distribution network (PDN). A resistive ...