Characterization of Integrated Circuit Packaging Materials

Figure 1.4 Acoustic microscope images of Au-Si eutectic die attach showing [left) 20%

and [right) 45% good die attach by area. Dark areas are well bonded, whereas

light areas are unbonded.

attach and hence possesses a broader range of application than X-ray radiography

(Figure 1.4). Acoustic microscopy is, however, somewhat more time-consuming.

X-ray radiography inspection systems that operate in real time are available. A

C-AM, however, can take several minutes to scan a single device. (Some timesav-

ings are achieved in loading and inspecting larger groups of devices in both ap-

proaches.) Additionally, C-AM is not limited by high-density materials ...