21 CMOS VLSI Interlude
Way back in Chapter 18, we took a step away from breaking chips to quickly study how dice were packaged. We saw that after being sawn apart, dice were glued to a lead frame and then wire bonded to pins. The entire frame was then encased in epoxy, after which the pins would be bent to the right shape and the excess of the frame would be cut away. In this chapter, we’ll take a deeper look into how chips are designed and manufactured. This won’t be as thorough as a real book on VLSI, so please study one of those books if you need to know this in detail.
Very large scale integration (VLSI) is the technology by which millions or even billions of metal oxide semiconductor (MOS) transistors are placed onto microchips. These transistors ...
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