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Microcontroller Exploits
book

Microcontroller Exploits

by Travis Goodspeed
September 2024
Intermediate to advanced
408 pages
7h 29m
English
No Starch Press
Content preview from Microcontroller Exploits

21  CMOS VLSI Interlude

Way back in Chapter 18, we took a step away from breaking chips to quickly study how dice were packaged. We saw that after being sawn apart, dice were glued to a lead frame and then wire bonded to pins. The entire frame was then encased in epoxy, after which the pins would be bent to the right shape and the excess of the frame would be cut away. In this chapter, we’ll take a deeper look into how chips are designed and manufactured. This won’t be as thorough as a real book on VLSI, so please study one of those books if you need to know this in detail.

Very large scale integration (VLSI) is the technology by which millions or even billions of metal oxide semiconductor (MOS) transistors are placed onto microchips. These transistors ...

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Publisher Resources

ISBN: 9781098182243Errata Page