Book description
This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive layers. This is a must-have reference for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing.
From the Reviews...
"This handbook will be a valuable resource for many academic libraries. Many engineering librarians who work with a variety of programs (including, but not limited to Materials Engineering) should include this work in their collection. My recommendation is to add this work to any collection that serves a campus with a materials/manufacturing/electrical/computer engineering programs and campuses with departments of physics and/or chemistry with large graduate-level enrollment."
—Randy Wallace, Department Head, Discovery Park Library, University of North Texas
Table of contents
- Cover
- Half Title page
- Title page
- Copyright page
- Foreword
- Introduction
-
Part 1: Fundamentals
-
Chapter 1: Surface and Colloidal Chemical Aspects of Wet Cleaning
- 1.1 Introduction to Surface Chemical Aspects of Cleaning
- 1.2 Chemistry of Solid-Water Interface
- 1.3 Particulate Contamination: Theory and Measurements
- 1.4 Influence of Surface Electrical Charges on Metal Ion Adsorption
- 1.5 Wettability of Surfaces
- 1.6 High Aspect Ratio Cleaning: Narrow Structures
- 1.7 Surface Tension Gradient: Application to Drying
- 1.8 Summary
- References
- Chapter 2: The Chemistry of Wet Cleaning
- Chapter 3: The Chemistry of Wet Etching
- Chapter 4: Surface Phenomena: Rinsing and Drying
-
Chapter 5: Fundamental Design of Chemical Formulations
- 5.1 Introduction and Overview
- 5.2 Historical Development of Formulations for the Integrated Circuit Industry
- 5.3 Mechanism of Stripping, Cleaning, and Particle Removal
- 5.4 Components and Additives in Chemical Formulations
- 5.5 Creating Chemical Formulations
- 5.6 Environmental, Safety, and Health Aspects
- Acknowledgments
- References
-
Chapter 6: Filtering, Recirculating, Reuse, and Recycling of Chemicals
- 6.1 Overview of Wet Chemical Contamination Control
- 6.2 Bulk Chemical Distribution for Wet Cleaning Tools
- 6.3 Chemical Distribution, Filtering, and Recirculation Requirements for Wet Cleaning Tools
- 6.4 Contamination Control Metrology
- 6.5 Effects of Contamination
- 6.6 Filtration
- 6.7 Chemical Blending, Recycling, and Reuse
- 6.8 Summary
- References
-
Chapter 1: Surface and Colloidal Chemical Aspects of Wet Cleaning
-
Part 2: Applications
- Chapter 7: Cleaning Challenges of High-k/Metal Gate Structures
- Chapter 8: High Dose Implant Stripping
- Chapter 9: Aluminum Interconnect Cleaning and Drying
- Chapter 10: Low-κ/CU Cleaning and Drying
- Chapter 11: Corrosion and Passivation of Copper
- Chapter 12: Germanium Surface Conditioning and Passivation
-
Chapter 13: Wafer Reclaim
- 13.1 Introduction to Wafer Reclaim
- 13.2 Introduction to Silicon Manufacturing for Semiconductor Applications
- 13.3 Energy Requirements for Silicon Wafer Manufacturing
- 13.4 Test Wafer Usage and Wafer Reclaim
- 13.5 Requirements for Wafer Reclaim and Recycle
- 13.6 Wafer Reclaim Options
- 13.7 Types of Wafer Reclaim Processes
- 13.8 Formulated Reclaim Solutions
- Acknowledgements
- References
- Chapter 14: Direct Wafer Bonding Surface Conditioning
-
Part 3: New Directions
-
Chapter 15: Novel Analytical Methods for Cleaning Evaluation
- 15.1 Introduction
- 15.2 Novel Analytical Methods
- 15.3 Recent Advances in Total Reflection X-ray Fluorescence Spectroscopy Analysis
- 15.4 Advances in Vapor Phase Analysis
- 15.5 Trace Metal Contamination on the Edge and Bevel of a Wafer
- 15.6 Kelvin Probe Technologies
- 15.7 Novel Applications of Electron Spectroscopy Techniques
- 15.8 Novel X-ray Spectroscopy Techniques
- 15.9 Electrochemical Sensors
- 15.10 Summary
- Acknowledgments
- References
-
Chapter 16: Stripping and Cleaning for Advanced Photolithography Applications
- 16.1 Introduction to Advance Stripping Applications
- 16.2 Historical Background
- 16.3 Recent Trends for Photoresist Stripping and Post-etch Residue Removal
- 16.4 Single Wafer Tools
- 16.5 Wetting in Small Dimensions and Cleaning Challenges
- 16.6 Environmental Health and Safety
- 16.7 The Future of Advanced Photoresist Stripping and Cleaning
- Acknowledgements
- References
-
Chapter 15: Novel Analytical Methods for Cleaning Evaluation
- Index
Product information
- Title: Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications
- Author(s):
- Release date: January 2011
- Publisher(s): Wiley
- ISBN: 9780470625958
You might also like
book
Handbook of Silicon Based MEMS Materials and Technologies
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with …
book
Functionalization of Semiconductor Surfaces
This book presents both fundamental knowledge and latest achievements of this rapidly growing field in the …
book
Handbook of Organic Materials for Optical and (Opto)Electronic Devices
Small molecules and conjugated polymers, the two main types of organic materials used for optoelectronic and …
book
Smart Sensors and MEMS, 2nd Edition
Smart Sensors and MEMS: Intelligent Devices and Microsystems for Industrial Applications, Second Edition highlights new, important …