POWER ELECTRONICS HANDBOOK, 3rd Edition

44

Packaging and Smart Power Systems

Douglas C. Hopkins, Ph.D.

Dir.—Electronic Power and Energy Research Laboratory, University at Buffalo, 332 Bonner Hall, Buffalo, New York, USA

44.1 Introduction

44.2 Background

44.3 Functional Integration

44.3.1 Steps to Partitioning

44.4 Assessing Partitioning Technologies

44.4.1 Levels of Packaging

44.4.2 Technologies

44.4.3 Semiconductor Power Integrated Circuits

44.5 Cost-driven Partitioning

44.6 Technology-driven Partitioning

44.7 Example 2.2 kW Motor Drive Design

44.7.1 User Requirements (Constraints)

44.7.2 Component Characterization Map

44.7.3 Component Grouping

44.7.4 Strategic Partitioning with Constraints

44.7.5 Optimization within Partitions

44.8 High Temperature (HT) Packaging

44.8.1 ...