Contents
1 Degradation Of Rise Time In Interconnects
1.1. Propagation issues in interconnects
1.2. Behavior of components at high frequencies
1.3. Effect on transmission of signals on interconnects
2 Electromagnetic Modeling of Interconnects
2.1. Global modeling of signal integrity
2.3. Capacitive and inductive modeling
2.5. Application to electronic packages and MCM
3 Controlled Impedance Interconnects
3.2. Influence of rise time on signal degradation
3.3. Model of a controlled impedance interconnect
3.5. Impedance control for a microstrip configuration
3.6. Analysis of propagation in interconnects
3.7. Effect on data bus configuration
3.8. Application to clock distribution
4 Propagation on Transmission Lines
4.2. Propagation modes related to substrate
4.3. Equation of propagation on transmission lines
5 The S-Parameters Testing Technique
5.1. Definition of measured parameters
5.2. The S-parameters principle
5.3. Measurement of S parameters
5.4. Measurement of characteristic line impedance
5.5. Measurement of line capacitance
5.6. Components on PCB and de-embedding techniques
5.7. Characterization of dielectric materials for interconnects
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