8.1 Introduction8.2 2.5D IC: Redistribution Layer (RDL) and TSV‐Interposer8.3 2.5D IC: Silicon, Glass, and Organic Substrates8.4 2.5D IC: HBM on Silicon Interposer8.5 3D IC: Memory Bandwidth Challenge for High‐Performance Computing8.6 3D IC: Electrical and Thermal TSVs8.7 3D IC: 3D‐Stacked Memory and Integrated Memory Controller8.8 Innovative Packaging for Modern Chips/Chiplets8.9 Power Distribution for 3D IC Integration8.10 Challenge and TrendProblemsReferences