Electronic Packaging Science and Technology

Preface

As we enter the big data era, mobile devices are ubiquitous. Internet of things (IoT) is everywhere, and we have man‐to‐man, man‐to‐machine, and machine‐to‐machine communications. Furthermore, in the Covid‐19 virus pandemic period, the trend of distance teaching, distance medicine, home office, and on‐line meeting has increased greatly the need of advanced consumer electronic products, demanding smaller form factor, larger memory, more functions, faster and larger data collection and transmission, cheaper cost, and superb reliability. At the same time, 5G advanced communication technology and 3D IC devices have begun their impact to our society, and many new artificial intelligence (AI) applications have been invented.

With the perceived slowing down of Moore’s law of miniaturization of Si chip technology, microelectronic industry is searching for alternative ways to sustain Moore’s law. 3D IC is most promising in achieving more‐than‐Moore, wherein the up‐scale of packaging technology is critical. Indeed, new advanced packaging factories are being built worldwide. We ask what will be the technical innovations in electronic packaging for 3D IC devices in order to enhance performance and reliability? Or, what are the challenging issues in electronic packaging technology that are essential in the near future development of semiconductor technology?

The goal of this book to present the science and engineering of advanced electronic packaging technology for a deeper understanding ...