May 2014
Intermediate to advanced
476 pages
14h 38m
English
A. Lahav, Tower Semiconductor Ltd, Israel
A. Fenigstein and A. Strum, TowerJazz, USA
This chapter reviews modern manufacturing techniques for backside illuminated (BSI) CMOS image sensors (CIS). It presents a thorough discussion regarding the advantages and disadvantages of the front illuminated CIS throughout different CMOS fabrication nodes and introduces a historical review, state-of-the-art discussion on the technological issues as well as on the applications and performance of back illuminated imagers. The chapter discusses all the relevant state-of-the-art issues of the imagers in both, commercial applications as well as high-performance ...
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