Book description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.- Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints
- New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections
- New chapter on testing procedures, sample handling and sample selection, and experimental design
- Coverage of new packaging materials, including plastics and composites
Table of contents
- Cover image
- Title page
- Table of Contents
- Copyright
- Dedication
- Preface to the Second Edition
- Preface to the First Edition
- Acknowledgments
- Chapter 1. An Overview of Electronic Devices and Their Reliability
- Chapter 2. Electronic Devices: How They Operate and Are Fabricated
- Chapter 3. Defects, Contaminants, and Yield
-
Chapter 4. The Mathematics of Failure and Reliability
- 4.1. Introduction
- 4.2. Statistics and Definitions
- 4.3. All About Exponential, Lognormal, and Weibull Distributions
- 4.4. System Reliability
- 4.5. On the Physical Significance of Failure Distribution Functions
- 4.6. Prediction Confidence and Assessing Risk
- 4.7. A Skeptical and Irreverent Summary
- Statistics and Ignorance
- Superstition, Witchcraft, Prediction
- Statistics versus Physics
- Where Do I Begin?
- Reliability Prediction and MIL-HDBK-217
- 4.8. Epilogue—Final Comment
- Exercises
-
Chapter 5. Mass Transport-Induced Failure
- 5.1. Introduction
- 5.2. Diffusion and Atom Movements in Solids
- 5.3. Binary Diffusion and Compound Formation
- 5.4. Reactions at Metal–Semiconductor Contacts
- 5.5. EM Physics and Damage Models
- 5.6. EM in Practice
- 5.7. Stress Voiding
- 5.8. Multilevel Copper Metallurgy—EM and SV
- 5.9. Failure of Incandescent Lamps
- Exercises
- Chapter 6. Electronic Charge-Induced Damage
- Chapter 7. Environmental Damage to Electronic Products
- Chapter 8. Packaging Materials, Processes, and Stresses
- Chapter 9. Degradation of Contacts and Package Interconnections
- Chapter 10. Degradation and Failure of Electro-Optical Materials and Devices
- Chapter 11. Characterization and Failure Analysis of Materials and Devices
- Chapter 12. Future Directions and Reliability Issues
- Appendix
- Acronyms
- Index
Product information
- Title: Reliability and Failure of Electronic Materials and Devices, 2nd Edition
- Author(s):
- Release date: October 2014
- Publisher(s): Academic Press
- ISBN: 9780080575520
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