2.1 CMOS Processing2.1.1 The Silicon Wafer2.1.2 Photolithography and Well Definition2.1.3 Diffusion and Ion Implantation2.1.4 Chemical Vapor Deposition and Defining the Active Regions2.1.5 Transistor Isolation2.1.6 Gate-Oxide and Threshold-Voltage Adjustments2.1.7 Polysilicon Gate Formation2.1.8 Implanting the Junctions, Depositing SiO2, and Opening Contact Holes2.1.9 Annealing, Depositing and Patterning Metal, and Overglass Deposition2.1.10 Additional Processing Steps2.2 CMOS Layout and Design Rules2.2.1 Spacing Rulesy2.2.2 Planarity and Fill Requirements2.2.3 Antenna Rules2.2.4 Latch-Up2.3 Variability and Mismatch2.3.1 Systematic Variations Including Proximity Effects2.3.2 Process Variations2.3.3 Random Variations and Mismatch2.4 Analog Layout Considerations2.4.1 Transistor Layouts2.4.2 Capacitor Matching2.4.3 Resistor Layout2.4.4 Noise Considerations2.5 Key Points2.6 References2.7 Problems