December 1999
Intermediate to advanced
258 pages
5h 23m
English
This chapter ties together, literally, all the components discussed up to this point. Three different circuit technologies used to manufacture RF components are introduced: discrete, hybrid, and MMIC. Their differences are noted, as well as the reasons why one is chosen over another in a particular situation. The three are also viewed from the standpoint of both performance and cost impact. Additionally, this chapter covers three different component interconnection schemes: cable, waveguide, and traces. Once again, the reasons why one is chosen over another are pointed out.
This chapter also introduces you to two different circuit philosophies: lumped element and distributed. With these you will see how some RF ...
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